GEIA HB 0005 2 PDF

Buy GEIA HB (R) Technical Guidelines For Aerospace And High Performance Electronic Systems Containing Lead-Free Solder And Finishes. Find the most up-to-date version of GEIA-STD at Engineering TechAmerica GEIA-HB Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-Free Solder.

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He showed several examples of actual failures, and other instances where whiskers had grown but not yet been detected electrically. Finally, a good number of texts and a continuously increasing amount of data is now available in the open literature.

While the Pb-free movement may appear ominous and challenging, there are tools and resources available to the designer. Subscription pricing is determined by: Please first log in with a verified email before hbb to alerts.

As the voice of the U. The assemblies were constantly monitored at a test voltage of 15 volts with a series resistor to limit current to 15 milliamps. Having started out as a “laundry list” of Pb-free concerns and challenges identified by the ADHP industry, the guide is structured such that those “delta” considerations, i.

With a heavy dependence on COTS to maintain a competitive edge, the industry is heavily influenced by the commercial supply chain and its increasing use of Pb-free materials. We have no amendments or corrections for this standard.

Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1

A whisker one micron in diameter could support a current of 10 mA. He distributed copies to delegates, and it is available on-line for free download by clicking here. Dr Dunn had collected data on whiskering effects over a period of 32 years, using the C-Ring test to introduce tensile and compressive stress, with different metal substrates, barrier layers and tin plating thicknesses, and the results were shortly to be published.

But higher pulse frequencies could result in greatly accelerated whisker growth, which was believed to be favoured by fine grained columnar structures. Martin Wickham reviewed previous findings and gave an update on current work. On behalf of ESA, a working group led by Dr Dunn had produced a comprehensive set of guidelines for creating a lead-free control plan, which described the problems, requirements and methods relevant to the preparation of a plan for companies to control against the use of lead-free components and to ensure that pure tin did not find its way into the manufacturing chain.

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Engineers will need to “act like engineers” in order to comprehend this information and apply it to their needs. Possible future work would investigate the effects of vibration and forced air cooling. Your Alert Profile lists the documents that will be monitored.

There had been a move away from component termination material type, structure and processing as specific mitigation strategies. Upon reviewing these plans, several research consortiums and organizations embraced the plan and, to date, have addressed many of the technical needs although the significant effort of obtaining sufficient data to develop Pbfree reliability models still remains unanswered [15]. A proprietary bright tin plating process was used.

This standard is applicable to Aerospace and High Performance electronic applications which procure equipment that may contain Pb-free tin finishes. The space environment presented particular challenges to electronic systems: You may delete a document from your Alert Profile at any time.

Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1

Environment Impact on Assembly, Printing and Reflow. One observation was that failure predominantly occurred at the edges of plates, where geiia coating thickness was not maintained around the right angle bend, and this geometry was a characteristic feature of component leads. But how do we set about mitigating against such failure where the use of pure tin finished components is unavoidable? Some key resources include the following set of standards and handbooks developed for working with Pb-free materials in various electronics applications: A Circuitnet Media Publication.

The plan included a list of tasks necessary to provide ADHP engineers sufficient information to minimize risks associated with Pb-free solders and finishes.

Living With PB-Free in High Performance Engineering Design

Summarizing at a high level, these challenges represent risks associated with 1 durability of the interconnection and 2 deleterious effects of tin whiskers. A series of collaborative projects had been carried out at the National Physical Laboratory to evaluate conformal coating as geja tin whisker mitigation strategy for printed circuit assemblies. Using the analogue of two sword-fencers for illustration, Wickham explained different failure modes: Cawthorne reviewed the definitions of the mitigation control levels defined 000 GEIA-STD, commenting that the required level would normally be a function of the design authority in consultation with the customer, and that military applications would typically expect mitigation to at least Level 2B—risks managed primarily through mitigations, including design rules, and more likely 2C—risks managed more by avoidance and less by mitigation.

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No, the group members do not all have curly hair! Using a tin plating process deliberately chosen for it high propensity to whiskering, NPL had developed a parallel plate test vehicle that had been enabled electrical detection of failure. Need more than one copy? Trends for Printing Ultra Miniature Chips. While considerable progress has been made in closing Pb-free knowledge gaps, the challenge of characterizing performance and reliability still needs to be addressed.

Other viable mitigation practices were hot-dip tinning for structural steel parts, or hot-oil fused tin plating.

The higher current densities tended to favour the formation of large eruptions, rather than filament whiskers. Remoteness and the inability to repair systems in situ obviously made the reliability issue even more critical, albeit for example Voyager 1 was still functioning after 39 years in operation. Already Subscribed to this document. Although equipment designed to go into space was exempt from the RoHS Directive, the reliability of space projects clearly depended on the integrity of PCBs, components and assembly processes.