This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a. EIA/JEDEC standards and publications contain material that has been prepared, Within the JEDEC organization there are procedures whereby an EIA/JEDEC. additional reliability stress testing (i.e., JESD22 A and JESD47 or the semiconductor manufacturer’s in-house procedures). Passing the reject criteria in this.

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The standard establishes a symbol and label that will gain the attention of those persons who might inflict electrostatic damage to the device. Displaying 1 – 20 of 38 documents.

Projections can be used to compare reliability performance with objectives, provide line feedback, support service cost estimates, and set product test and screen strategies to ensure that the ELFR meets customers’ requirements. Registration or login required. This standard establishes the information required by semiconductor users from IC manufacturers and distributors in order to judge whether a semiconductor component is fit for use in their particular application.

It should be noted that this standard does not cover or apply to thermal shock chambers. This standard is intended to describe specific stresses and failure mechanisms that are specific to compound semiconductors and power amplifier modules.

Filter by document type: Show 5 10 20 results per page. The test method can also be used to shear aluminum and copper wedge bonds to a jess or package bonding surface.

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This document describes package-level test and data methods for the qualification of semiconductor technologies. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. This standard provides a method for determining solid state devices capability to withstand extreme temperature cycling. Solid State Memories JC Multiple Chip Packages JC This standard defines methods for calculating the early life failure rate of a product, using accelerated testing, whose failure rate is constant or decreasing over time.


Please see Annex C for revision history. This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. Stress 1 Apply Thermal.

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It establishes a set of data elements that describes the component and defines what each element means. The document is organized in different sections to ria as many technical details as possible to support the purpose given in the abstract. Search by Keyword or Document Number. The symbol contained in this label, which may be used on the device itself, shows a hand in a triangle with a bar through it.

The detailed use and application of burn-in is outside the scope of this document. It will be shown through this document why realistic modifying of the ESD target levels for component level ESD is not only essential but is also urgent. Endurance and retention qualification specifications for cycle counts, durations, temperatures, and sample sizes are specified in JESD47 or may be developed using knowledge-based methods as in JESD For technologies where there is adequate field failure data, alternative methods may be used to establish the early life failure rate.

This document was written with the intent to provide information for quality organizations in both semiconductor companies and their customers to assess and make decisions on safe ESD level requirements. As such, it is recommended that assembly level testing be performed to determine if there are any adverse effects on that component due to its assembly to a PWB.


Thermally activated failure mechanisms are modeled using the Arrhenius Equation for acceleration. During the test, accelerated stress temperatures wia used without electrical conditions iesd. This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high- and low-temperature extremes. Formerly known as EIA Pictures have been added to enhance the fail mode diagrams. Terms, Definitions, ea Symbols filter JC This test is used to determine the effects of bias conditions and temperature on solid state devices over time.

This document describes backend-level test and data methods for the qualification of semiconductor technologies. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. Most of the content on this site remains free to download with registration.

This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. It is intended to establish more meaningful and efficient qualification testing. It does not define the quality eiw reliability requirements that the component must satisfy.